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《信号完整性与电源完整性分析》[49M]百度网盘|亲测有效|pdf下载

  • 信号完整性与电源完整性分析

  • 出版社:国图书店图书专营店
  • 出版时间:2007-02
  • 热度:11851
  • 上架时间:2024-06-30 09:38:03
  • 价格:0.0
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内容介绍

  商品基本信息，请以下列介绍为准
商品名称：信号完整性与电源完整性分析(第3版英文版)/国外电子与通信教材系列
作者：(美)埃里克·伯格丁
定价：119.0
出版社：电子工业出版社
出版日期：2007-02-01
ISBN：9787121407833
印次：1
版次：2
装帧：
开本：16开

  内容简介
本书全面论述了信号完整性与电源完整性问题。主要讲述信号与电源完整性分析及物理设计概论，4类信号与电源完整性问题的实质含义，物理互连设计对信号完整性的影响，电容、电感、电阻和电导的特性分析，求解信号与电源完整性问题的4种实用技术途径，推导和仿真背后隐藏的解决方案，以及信号与电源完整性的推荐设计准则等。本书还讨论了信号与电源完整性中S参数的应用问题，并给出了电源分配网络的设计实例。本书强调直觉理解、实用工具和工程素养。作者以实践专家的视角指出造成信号与电源完整性问题的根源，并给出了设计阶段前期的问题解决方案。
本书是面向电子行业设计工程师和产品负责人的一本具有实用价值的参考书，研读此书有助于在信号与电源完整性问题出现之前并及早加以解决。同时，本书也可作为相关专业本科生及研究生的双语教学用书。

  目录
Chapter 1 Signal Integrity Is in Your Future
1.1 What Are Signal Integrity, Power Integrity, and Electromagnetic Compatibility?
1.2 Signal-Integrity Effects on One Net
1.3 Cross Talk
1.4 Rail-Collapse Noir/> 1.5 ElectroMagnetic Interference (EMI)
1.6 Two Important Signal-Integrity Generalizationr/> 1.7 Trends in Electronic Productr/> 1.8 The Need for a New Design Methodology
1.9 A New Product Design Methodology
1.10 Simulationr/> 1.11 Modeling and Modelr/> 1.12 Creating Circuit Models from Calculation
1.13 Three Types of Measurementr/> 1.14 The Role of Measurementr/> 1.15 The Bottom Line
Chapter 2 Time and Frequency Domainr/> 2.1 The Time Domain
2.2 Sine Waves in the Frequency Domain
2.3 Shorter Time to a Solution in the Frequency Domain
2.4 Sine-Wave Featurer/> 2.5 The Fourier Transform
2.6 The Spectrum of a Repetitive Signal
2.7 The Spectrum of an Ideal Square Wave
2.8 From the Frequency Domain to the Time Domain
2.9 Effect of Bandwidth on Rise Time
2.10 Bandwidth and Rise Time
2.11 What Does Significant Mean?
2.12 Bandwidth of Real Signalr/> 2.13 Bandwidth and Clock Frequency
2.14 Bandwidth of a Measurement
2.15 Bandwidth of a Model
2.16 Bandwidth of an Interconnect
2.17 The Bottom Line
Chapter 3 Impedance and Electrical Modelr/> 3.1 Describing Signal-Integrity Solutions in Terms of Impedance
3.2 What Is Impedance?
3.3 Real Versus Ideal Circuit Elementr/> 3.4 Impedance of an Ideal Resistor in the Time Domain
3.5 Impedance of an Ideal Capacitor in the Time Domain
3.6 Impedance of an Ideal Inductor in the Time Domain
3.7 Impedance in the Frequency Domain
3.8 Equivalent Electrical Circuit Modelr/> 3.9 Circuit Theory and SPICE
3.10 Introduction to Measurement-Based Modeling
3.11 The Bottom Line
Chapter 4 The Physical Basis of Resistance
4.1 Translating Physical Design into Electrical Performance
4.2 The Only Good Approximation for the Resistance of Interconnectr/> 4.3 Bulk Resistivity
4.4 Resistance per Length
4.5 Sheet Resistance
4.6 The Bottom Line
Chapter 5 The Physical Basis of Capacitance
5.1 Current Flow in Capacitorr/> 5.2 The Capacitance of a Sphere
5.3 Parallel Plate Approximation
5.4 Dielectric Constant
5.5 Power and Ground Planes and Decoupling Capacitance
5.6 Capacitance per Length
5.7 2D Field Solverr/> 5.8 Effective Dielectric Constant
5.9 The Bottom Line
Chapter 6 The Physical Basis of Inductance
6.1 What Is Inductance?
6.2 Inductance Principle 1: There Are Circular Rings of Magnetic-Field Lines Around All Currentr/> 6.3 Inductance Principle 2: Inductance Is the Number of Webers of Field Line Rings Around a Conductor per Amp of Current Through It
6.4 Self-Inductance and Mutual Inductance
6.5 Inductance Principle 3: When the Number of Field Line Rings Around a Conductor Changes, There Will Be a Voltage Induced Across the Ends of the Conductor
6.6 Partial Inductance
6.7 Effective, Total, or Net Inductance and Ground Bounce
6.8 Loop Self- and Mutual Inductance
6.9 The Power Distribution Network (PDN) and Loop Inductance
6.10 Loop Inductance per Square of Planer/> 6.11 Loop Inductance of Planes and Via Contactr/> 6.12 Loop Inductance of Planes with a Field of Clearance Holer/> 6.13 Loop Mutual Inductance
6.14 Equivalent Inductance of Multiple Inductorr/> 6.15 Summary of Inductance
6.16 Current Distributions and Skin Depth
6.17 High-Permeability Materialr/> 6.18 y Currentr/> 6.19 The Bottom Line
Chapter 7 The Physical Basis of Transmission Liner/> 7.1 Forget the Word Ground
7.2 The Signal
7.3 Uniform Transmission Liner/> 7.4 The Speed of Electrons in Copper
7.5 The Speed of a Signal in a Transmission Line
7.6 Spatial Extent of the Leading Edge
7.7 "Be the Signal"
7.8 The Instantaneous Impedance of a Transmission Line
7.9 Characteristic Impedance and Controlled Impedance
7.10 Famous Characteristic Impedancer/> 7.11 The Impedance of a Transmission Line
7.12 Driving a Transmission Line
7.13 Return Pathr/> 7.14 When Return Paths Switch Reference Planer/> 7.15 A First-Order Model of a Transmission Line
7.16 Calculating Characteristic Impedance with Approximationr/> 7.17 Calculating the Characteristic Impedance with a 2D Field Solver
7.18 An n-Section Lumped-Circuit Model
7.19 Frequency Variation of the Characteristic Impedance
7.20 The Bottom Line
Chapter 8 Transmission Lines and Reflectionr/> 8.1 Reflections at Impedance Changer/> 8.2 Why Are There Reflectionr/> 8.3 Reflections from Resistive Loadr/> 8.4 Source Impedance
8.5 Bounce Diagramr/> 8.6 Simulating Reflected Waveformr/> 8.7 Measuring Reflections with a TDR
8.8 Transmission Lines and Unintentional Discontinuitier/> 8.9 When to Terminate
8.10 The Most Common Termination Strategy for Point-to-Point Topology
8.11 Reflections from Short Series Transmission Liner/> 8.12 Reflections from Short-Stub Transmission Liner/> 8.13 Reflections from Capacitive End Terminationr/> 8.14 Reflections from Capacitive Loads in the Mle of a Trace
8.15 Capacitive Delay err/> 8.16 Effects of Corners and Viar/> 8.17 Loaded Liner/> 8.18 Reflections from Inductive Discontinuitier/> 8.19 Compensation
8.20 The Bottom Line
Chapter 9 Lossy Lines, Rise-Time Degradation, and Material Propertier/> 9.1 Why Worry About Lossy Liner/> 9.2 Losses in Transmission Liner/> 9.3 Sources of Loss: Conductor Resistance and Skin Depth
9.4 Sources of Loss: The Dielectric
9.5 Dissipation Factor
9.6 The Real Meaning of Dissipation Factor
9.7 Modeling Lossy Transmission Liner/> 9.8 Characteristic Impedance of a Lossy Transmission Line
9.9 Signal Velocity in a Lossy Transmission Line
9.10 Attenuation and dB
9.11 Attenuation in Lossy Liner/> 9.12 Measured Properties of a Lossy Line in the Frequency Domain
9.13 The Bandwidth of an Interconnect
9.14 Time-Domain Behavior of Lossy Liner/> 9.15 Improving the Eye Diagram of a Transmission Line
9.16 How Much Attenuation Is Too Much?
9.17 The Bottom Line
Chapter 10 Cross Talk in Transmission Liner/> 10.1 Superposition
10.2 Origin of Coupling: Capacitance and Inductance
10.3 Cross Talk in Transmission Lines: NEXT and FEXT
10.4 Describing Cross Talk
10.5 The SPICE Capacitance Matrix
10.6 The Maxwell Capacitance Matrix and 2D Field Solverr/> 10.7 The Inductance Matrix
10.8 Cross Talk in Uniform Transmission Lines and Saturation Length
10.9 Capacitively Coupled Currentr/> 10.10 Inductively Coupled Currentr/> 10.11 Near-End Cross Talk
10.12 Far-End Cross Talk
10.13 Decreasing Far-End Cross Talk
10.14 Simulating Cross Talk
10.15 Guard Tracer/> 10.16 Cross Talk and Dielectric Constant
10.17 Cross Talk and Timing
10.18 Switching Noir/> 10.19 Summary of Reducing Cross Talk
10.20 The Bottom Line
Chapter 11 Differential Pairs and Differential Impedance
11.1 Differential Signaling
11.2 A Differential Pair
11.3 Differential Impedance with No Coupling
11.4 The Impact from Coupling
11.5 Calculating Differential Impedance
11.6 The Return-Current Distribution in a Differential Pair
11.7 and Even Moder/> 11.8 Differential Impedance and -Mode Impedance
11.9 Common Impedance and Even-Mode Impedance
11.10 Differential and Common Signals and - and Even-Mode Voltage Componentr/> 11.11 Velocity of Each Mode and Far-End Cross Talk
11.12 Ideal Coupled Transmission-Line Model or an Ideal Differential Pair
11.13 Measuring Even- and -Mode Impedance
11.14 Terminating Differential and Common Signalr/> 11.15 Conversion of Differential to Common Signalr/> 11.16 EMI and Common Signalr/> 11.17 Cross Talk in Differential Pairr/> 11.18 Crossing a Gap in the Return Path
11.19 To Tightly Couple or Not to Tightly Couple
11.20 Calculating and Even Modes from Capacitance- and Inductance-Matrix Elementr/> 11.21 The Impedance Matrix
11.22 The Bottom Line
Chapter 12 S-Parameters for Signal-Integrity Applicationr/> 12.1 S-Parameters, the New Universal Metric
12.2 What Are S-Parameterr/> 12.3 Basic S-Parameter Formalir/> 12.4 S-Parameter Matrix Elementr/> 12.5 Introducing the Return and Insertion Lor/> 12.6 A Transparent Interconnect
12.7 Changing the Port Impedance
12.8 The Phase of S21 for a Uniform 50-Ohm Transmission Line
12.9 The Magnitude of S21 for a Uniform Transmission Line
12.10 Coupling to Other Transmission Liner/> 12.11 Insertion Loss for Non-50-Ohm Transmission Liner/> 12.12 Data-Mining S-Parameterr/> 12.13 Single-Ended and Differential S-Parameterr/> 12.14 Differential Insertion Lor/> 12.15 The Mode Conversion Termr/> 12.16 Converting to Mixed-Mode S-Parameterr/> 12.17 Time and Frequency Domainr/> 12.18 The Bottom Line
Chapter 13 The Power Distribution Network (PDN)
13.1 The Problem
13.2 The Root Caur/> 13.3 The Most Important Design Guidelines for the PDN
13.4 Elishing the Target Impedance Is Hard
13.5 Every Product Has a Unique PDN Requirement
13.6 Engineering the PDN
13.7 The VRM
13.8 Simulating Impedance with SPICE
13.9 On-Die Capacitance
13.10 The Package Barrier
13.11 The PDN with No Decoupling Capacitorr/> 13.12 The MLCC Capacitor
13.13 The Equivalent Series Inductance
13.14 Approximating Loop Inductance
13.15 Optimizing the Mounting of Capacitorr/> 13.16 Combining Capacitors in Parallel
13.17 Engineering a Reduced Parallel Resonant Peak by ing More Capacitorr/> 13.18 Selecting Capacitor Valuer/> 13.19 Estimating the Number of Capacitors Needed
13.20 How Much Does a nH Cost?
13.21 Quantity or Specific Valuer/> 13.22 Sculpting the Impedance Profiles: The Frequency-Domain Target Impedance Method (FDTIM)
13.23 When Every pH Countr/> 13.24 Location, Location, Location
13.25 When Spreading Inductance Is the Limitation
13.26 The Chip View
13.27 Bringing It All Together
13.28 The Bottom Line
Appendix A 100+ General Design Guidelines to Minimize Signal-Integrity Problemr/>Appendix B 100 Collected Rules of Thumb to Help Estimate Signal-Integrity Effectr/>Appendix C Selected Referencer/>

  作者简介
埃里克·伯格丁（Eric Bogatin)，beTheSignal.comTeledyne LeCroy Signal Integrity Academy的院长，美国科罗拉多大学博尔德分校电气、计算机与能源工程(ECEE)系教授。BogatirI于麻省理工学院获得物理学士学位，于亚利桑那大学图森分校获得物理学硕士和博士学位。在全球范围信号完整性课程和讲座，并于2013年起通过为个人和公司提供在线培训课程。Bogtin是DesigrlCon的2016年度工程师奖的获得者。

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